Πλοήγηση ανά Θέμα "Software package SIMULOR"

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    • Conference Object  

      Numerical simulation of die filling in semisolid metal processing 

      Bardinet, F.; Alexandrou, Andreas N.; Loue, Willem (Affiliation: WPI, Worcester, United StatesCorrespondence Address: Bardinet, FrancoisWPI, Worcester, United States, 1997)
      Semisolid Metal Processing offers distinct advantages over other near-net-shape technologies, such as a more homogeneous microstructure, less porosity and thus excellent mechanical properties. A perfect control of die ...