Regularized collocation Trefftz method for void detection in two-dimensional steady-state heat conduction problems
Ημερομηνία
2014ISSN
1741-5977Source
Inverse Problems in Science and EngineeringVolume
22Issue
3Pages
395-418Google Scholar check
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Εμφάνιση πλήρους εγγραφήςΕπιτομή
We propose the use of the collocation Trefftz method for the solution of inverse geometric problems and, in particular, the determination of the boundary of a void. As was the case in the solution of such problems using the method of fundamental solutions, the algorithm for imaging the interior of the medium also makes use of radial polar parametrization of the unknown void shape in two dimensions. The centre of this radial polar parametrization is considered to be unknown. The feasibility of this new method is illustrated by several numerical examples highlighting its advantages and shortcomings. © 2013 Taylor & Francis.
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