Browsing by Subject "Software package SIMULOR"
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Conference Object
Numerical simulation of die filling in semisolid metal processing
(Affiliation: WPI, Worcester, United StatesCorrespondence Address: Bardinet, FrancoisWPI, Worcester, United States, 1997)Semisolid Metal Processing offers distinct advantages over other near-net-shape technologies, such as a more homogeneous microstructure, less porosity and thus excellent mechanical properties. A perfect control of die ...