Browsing Τμήμα Μηχανικών Μηχανολογίας και Κατασκευαστικής / Department of Mechanical and Manufacturing Engineering by Subject "Wafer bonding"
Now showing items 1-1 of 1
-
Article
Spark ignitable Ni-Al ball-milled powders for bonding applications
(2014)Ball milling of aluminum (Al) and nickel (Ni) particles at the NiAl composition can produce reactive powders with low spark ignition thresholds similar to magnetron sputtered multilayer foils (MFs). Such powders can replace ...