dc.contributor.author | Stavrou, Kyriakos | en |
dc.contributor.author | Trancoso, Pedro | en |
dc.creator | Stavrou, Kyriakos | en |
dc.creator | Trancoso, Pedro | en |
dc.date.accessioned | 2019-11-13T10:42:25Z | |
dc.date.available | 2019-11-13T10:42:25Z | |
dc.date.issued | 2005 | |
dc.identifier.issn | 0302-9743 | |
dc.identifier.uri | http://gnosis.library.ucy.ac.cy/handle/7/55036 | |
dc.description.abstract | Increased power density, hot-spots, and temperature gradients are severe limiting factors for today's state-of-the-art microprocessors. However, the flexibility offered by the multiple cores in future Chip Multiprocessors (CMPs) results in a great opportunity for controlling the chip thermal characteristics. When a process is to be assigned to a core, a thermal-aware scheduling policy may be invoked to determine which core is the most appropriate. In this paper we present TSIC, Thermal SImulator for CMPs, which is a fully parameterizable, user-friendly tool that allows us to easily test different CMP configurations, application characteristics, and scheduling policies. We also present a case study where the use of TSIC together with simple thermal-aware scheduling policies allows us to conclude that there is potential for improving the thermal behavior of a CMP by implementing new process scheduling policies. © Springer-Verlag Berlin Heidelberg 2005. | en |
dc.source | 10th Panhellenic Conference on Informatics, PCI 2005 | en |
dc.source.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-33646505077&doi=10.1007%2f11573036_56&partnerID=40&md5=913b38fc4fa9b2f94f0577a4a983ac47 | |
dc.subject | Computer simulation | en |
dc.subject | Scheduling | en |
dc.subject | Computer systems | en |
dc.subject | Microprocessor chips | en |
dc.subject | Computer applications | en |
dc.subject | Power density | en |
dc.subject | Chip Multiprocessors (CMPs) | en |
dc.subject | Integrated circuits | en |
dc.subject | Parameterizable | en |
dc.subject | Thermal scheduling simulator | en |
dc.title | TSIC: Thermal scheduling simulator for chip multiprocessors | en |
dc.type | info:eu-repo/semantics/article | |
dc.identifier.doi | 10.1007/11573036_56 | |
dc.description.volume | 3746 LNCS | en |
dc.description.startingpage | 589 | |
dc.description.endingpage | 599 | |
dc.author.faculty | 002 Σχολή Θετικών και Εφαρμοσμένων Επιστημών / Faculty of Pure and Applied Sciences | |
dc.author.department | Τμήμα Πληροφορικής / Department of Computer Science | |
dc.type.uhtype | Article | en |
dc.description.notes | <p>Sponsors: Alpha Bank, Greece | en |
dc.description.notes | Microsoft Hellas, Greece | en |
dc.description.notes | Hellenic Organization of Telecommunications | en |
dc.description.notes | Conference code: 67285 | en |
dc.description.notes | Cited By :3</p> | en |
dc.source.abbreviation | Lect. Notes Comput. Sci. | en |
dc.contributor.orcid | Trancoso, Pedro [0000-0002-2776-9253] | |
dc.gnosis.orcid | 0000-0002-2776-9253 | |