HARPA: Tackling physically induced performance variability
Date
2017Author
Zompakis, NikolaosNoltsis, Michail
Ndreu, L.
Hadjilambrou, Zacharias
Englezakis, Panayiotis
Nikolaou, Panagiota
Portero, Antoni
Libutti, S.
Massari, Giuseppe
Sassi, F.
Bacchini, A.

Sazeides, Yiannakis
Vavrik, R.
Golasowski, M.
Sevcik, J.
Vondrak, V.
Catthoor, F.
Fornaciari, W.
Soudris, Dimitrios J.
ISBN
978-3-9815370-9-3Publisher
Institute of Electrical and Electronics Engineers Inc.Source
Proceedings of the 2017 Design, Automation and Test in Europe, DATE 201720th Design, Automation and Test in Europe, DATE 2017
Pages
97-102Google Scholar check
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Show full item recordAbstract
Continuously increasing application demands on both High Performance Computing (HPC) and Embedded Systems (ES) are driving the IC manufacturing industry on an everlasting scaling of devices in silicon. Nevertheless, integration and miniaturization of transistors comes with an important and non-negligible trade-off: time-zero and time-dependent performance variability. Increasing guard-bands to battle variability is not scalable, since worst-case design margins are prohibitive for downscaled technology nodes. This paper discusses the FP7-612069-HARPA project of the European Commission which aims to enable next-generation embedded and high-performance heterogeneous many-cores to cost-effectively confront variations by providing Dependable-Performance: correct functionality and timing guarantees throughout the expected lifetime of a platform under thermal, power, and energy constraints. The HARPA novelty is in seeking synergies in techniques that have been considered virtually exclusively in the ES or HPC domains (worst-case guaranteed partly proactive techniques in embedded, and dynamic best-effort reactive techniques in high-performance). © 2017 IEEE.