dc.contributor.author | Milojevic, D. | en |
dc.contributor.author | Idgunji, S. | en |
dc.contributor.author | Jevdjic, D. | en |
dc.contributor.author | Ozer, E. | en |
dc.contributor.author | Lotfi-Kamran, P. | en |
dc.contributor.author | Panteli, Andreas | en |
dc.contributor.author | Prodromou, Andreas | en |
dc.contributor.author | Nicopoulos, Chrysostomos A. | en |
dc.contributor.author | Hardy, D. | en |
dc.contributor.author | Falsari, B. | en |
dc.contributor.author | Sazeides, Yiannakis | en |
dc.creator | Milojevic, D. | en |
dc.creator | Idgunji, S. | en |
dc.creator | Jevdjic, D. | en |
dc.creator | Ozer, E. | en |
dc.creator | Lotfi-Kamran, P. | en |
dc.creator | Panteli, Andreas | en |
dc.creator | Prodromou, Andreas | en |
dc.creator | Nicopoulos, Chrysostomos A. | en |
dc.creator | Hardy, D. | en |
dc.creator | Falsari, B. | en |
dc.creator | Sazeides, Yiannakis | en |
dc.date.accessioned | 2019-11-13T10:41:19Z | |
dc.date.available | 2019-11-13T10:41:19Z | |
dc.date.issued | 2012 | |
dc.identifier.isbn | 978-1-4673-3050-3 | |
dc.identifier.uri | http://gnosis.library.ucy.ac.cy/handle/7/54553 | |
dc.description.abstract | We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters. The integration of 3D-stacked Wide I/O DRAM on top of a logic die increases available memory bandwidth by using dense and fast Through-Silicon Vias (TSVs) instead of off-chip IOs, enabling faster data transfers at much lower energy per bit. We demonstrate a methodology that includes full-system microarchitectural modeling and rapid virtual physical prototyping with emphasis on the thermal analysis. Our findings show that while executing CPU-centric benchmarks (e.g. SPECInt and Dhrystone), the temperature in the server-on-chip (logic+DRAM) is in the range of 175-200°C at a power consumption of less than 20W, exceeding the reliable operating bounds without any cooling solutions, even with embedded cores. However, with real cloud workloads, the power density in the server-on-chip remains much below the temperatures reached by the CPU-centric workloads as a result of much lower power burnt by memory-intensive cloud workloads. We show that such a server-on-chip system is feasible with a low-cost passive heat sink eliminating the need for a high-cost active heat sink with an attached fan, creating an opportunity for overall cost and energy savings in datacenters. © 2012 IEEE. | en |
dc.source | Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors | en |
dc.source | 2012 IEEE 30th International Conference on Computer Design, ICCD 2012 | en |
dc.source.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84872092486&doi=10.1109%2fICCD.2012.6378637&partnerID=40&md5=e15980f09fb674f4f274efbf5e0b00bd | |
dc.subject | Costs | en |
dc.subject | Data transfer | en |
dc.subject | Thermal characterization | en |
dc.subject | Thermoanalysis | en |
dc.subject | Heat sinks | en |
dc.subject | Three dimensional computer graphics | en |
dc.subject | Lower energies | en |
dc.subject | Many-core | en |
dc.subject | Power efficient | en |
dc.subject | Cooling solutions | en |
dc.subject | Data centers | en |
dc.subject | Dynamic random access storage | en |
dc.subject | Embedded cores | en |
dc.subject | Memory bandwidths | en |
dc.subject | Off-chip | en |
dc.subject | Overall costs | en |
dc.subject | Physical prototyping | en |
dc.subject | Power densities | en |
dc.subject | Through silicon vias | en |
dc.title | Thermal characterization of cloud workloads on a power-efficient server-on-chip | en |
dc.type | info:eu-repo/semantics/conferenceObject | |
dc.identifier.doi | 10.1109/ICCD.2012.6378637 | |
dc.description.startingpage | 175 | |
dc.description.endingpage | 182 | |
dc.author.faculty | 002 Σχολή Θετικών και Εφαρμοσμένων Επιστημών / Faculty of Pure and Applied Sciences | |
dc.author.department | Τμήμα Πληροφορικής / Department of Computer Science | |
dc.type.uhtype | Conference Object | en |
dc.description.notes | <p>Sponsors: IEEE | en |
dc.description.notes | IEEE Circuits and Systems Society | en |
dc.description.notes | IEEE Computer Society | en |
dc.description.notes | Concordia University | en |
dc.description.notes | Ecole de Technologie Superieure (ETS) | en |
dc.description.notes | Conference code: 94819 | en |
dc.description.notes | Cited By :6</p> | en |
dc.contributor.orcid | Nicopoulos, Chrysostomos A. [0000-0001-6389-6068] | |
dc.gnosis.orcid | 0000-0001-6389-6068 | |